Elektronische Vorrichtung

Details

Veröffentlichungs-Nr.

EP4752937

Anmeldetag

17. Juli 2024

Veröffentlichung

30. Januar 2025

Rechtsraum

EP

Abstract

An electronic device is provided that can improve cooling capacity of a heating element built into an electronic device disposed in a plurality of postures. A heat pipe (50) includes a heat dissipation portion (51) connected to a heat sink (61, 62) and an outer surface (53) in contact with a heat transfer member (70), and includes a pipe lower portion (52) positioned below the heat transfer member (51) and extending in a direction intersecting the vertical direction when a device body (11) is in a vertical posture. The pipe lower portion (52) includes an extension portion (55) extending outside an outer edge of the heat transfer member (70).

Anmelder

Firma

Sony Interactive Entertainment Inc.

Land

🇯🇵 Japan