Datenweiterleitungsverfahren, Chip und Elektronische Vorrichtung

EP4753233 6. März 2025

Anmelder: Shenzhen Goodix Technology Co., Ltd. 🇨🇳

Details

Veröffentlichungs-Nr.
EP4753233
Anmeldetag
25. August 2023
Veröffentlichung
6. März 2025
Rechtsraum
EP
IPC
H04L67/12
Offizieller Volltext

Abstract

The present disclosure provides a data forwarding method, a physical layer chip, and an electronic device, which can implement high-speed, high-bandwidth, high-precision, and low-delay data transmission, wherein the data forwarding method is used for a physical layer device of sub-node in a transmission network, wherein the network comprises a head node and a plurality of sub-nodes, the head node and the plurality of sub-nodes are connected via a physical transmission medium, and the sub-node further comprises a transmission processing device, receiving, via a first branch of the physical layer device, a first downlink signal transmitted by the head node or a preceding adjacent sub-node among the plurality of sub-nodes through the physical transmission medium; enabling, via the first branch, a second branch of the physical layer device to obtain the first downlink signal through a forwarding module of the physical layer device; and sending, via the second branch, the first downlink signal to a succeeding adjacent sub-node among the plurality of sub-nodes through the physical transmission medium.

Anmelder

Firma
Shenzhen Goodix Technology Co., Ltd.
Land
🇨🇳 China
🇨🇳 Goodix Technology

Chinesischer Halbleiterhersteller mit Sitz in Shenzhen, spezialisiert auf Fingerabdrucksensoren, Touch-Controller und Sicherheitschips für mobile Endgeräte.

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