Halbleitergehäuse und Bond-Clip zur Verwendung in dem Halbleitergehäuse

Details

Veröffentlichungs-Nr.

EP4753439

Anmeldetag

28. November 2025

Veröffentlichung

3. Juni 2026

Rechtsraum

EP

Abstract

The present disclosure provides a semiconductor package comprising: a semiconductor die attached to a lead frame having lead terminals; at least one bond clip connecting the die to a lead terminal; a die top solder connecting the bond clip and the die, and an encapsulant. The clip comprises a die attachment portion having a die attachment portion side structured to be connected to the die, whereby said side is provided with a cavity functioning as an expansion space for the die top solder. This allows to prevent the molten die top solder from spreading toward die edge and lead terminals, since the molten solder flow is directed inward to the cavity, instead of flowing outward. A bond clip for use in a semiconductor package is also provided, comprising a cavity functioning as an expansion space for the die top solder. The cavity is arranged at the die attachment portion side of the bond clip.

Anmelder

Firma

Nexperia B.V.

Land

🇳🇱 Niederlande