Galvanisch Getrennte Kommunikationsverbindungen (gicl)-Verpackungsstruktur mit Integrierter Isolierung als Teil eines Chips

Details

Veröffentlichungs-Nr.

EP4753440

Anmeldetag

10. November 2025

Veröffentlichung

3. Juni 2026

Rechtsraum

EP

Abstract

Aspects of the subject disclosure may include, for example, a packaged integrated circuit device that includes two galvanically isolated integrated circuit die. The integrated circuit die include conductive coils that can be inductively coupled for wireless communications between the two galvanically isolated integrated circuit die. A first integrated circuit die is mounted to a lead frame and a second integrated circuit die is surrounded by a molding compound structure and an insulating layer. The second integrated circuit is adhered to the first integrated circuit in a manner that aligns the conductive coils and provides galvanic isolation between the two integrated circuit die. Other embodiments are disclosed.

Anmelder

Firma

NXP USA, Inc.

Land

🇺🇸 USA