Gicl-Verpackungsstruktur mit Verbesserter Kommunikation
Anmelder: NXP USA, Inc. 🇺🇸
Details
- Veröffentlichungs-Nr.
- EP4753441
- Anmeldetag
- 11. November 2025
- Veröffentlichung
- 3. Juni 2026
- Rechtsraum
- EP
- IPC
- H10W90/20, H10W90/28
Abstract
Aspects of the subject disclosure may include, for example, a packaged integrated circuit device that includes two galvanically isolated integrated circuit die. The integrated circuit die include conductive coils that can be inductively coupled for wireless communications between the two galvanically isolated integrated circuit die. One of the integrated circuit die is flip chip mounted to the other integrated circuit die with the coils facing each other across an insulating layer that includes routing to provide power to the flip chip mounted integrated circuit die. Other embodiments are disclosed.
Anmelder
- Firma
- NXP USA, Inc.
- Land
- 🇺🇸 USA
US-amerikanische Gesellschaft des Halbleiterkonzerns NXP, die Chips und Halbleiterlösungen für Automobiltechnik, Kommunikation und Industrieelektronik entwickelt.
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