Gespritzte Folie, Verfahren zur Formung davon und Gespritztes Element
Anmelder: SHIN-ETSU CHEMICAL CO., LTD. 🇯🇵
Details
- Veröffentlichungs-Nr.
- EP4756067
- Anmeldetag
- 20. November 2025
- Veröffentlichung
- 10. Juni 2026
- Rechtsraum
- EP
Abstract
A sprayed film including a film surface in which a value of an area ratio S/A obtained by dividing a surface area S (µm<sup>2</sup>) of a portion of the measurement surface (S-L surface) of the film surface within one evaluation region by an area A (µm<sup>2</sup>) of a portion of a reference surface forming a plane located at an arithmetic average height of the measurement surface (S-L surface), which is within the evaluation region is 1.75 or more and 3 or less, and a surface roughness Sa of a portion of the measurement surface (S-L surface) within the evaluation region is 0.4 µm or more and 8 µm or less.Generation of particles which is caused by cracks of the sprayed film can be reduced when dry etching using gas plasma is performed with a semiconductor manufacturing apparatus or the like using the sprayed film as a corrosion-resistant film.
Anmelder
- Firma
- SHIN-ETSU CHEMICAL CO., LTD.
- Land
- 🇯🇵 Japan
Japanisches Chemieunternehmen mit Sitz in Tokio. Shin-Etsu Chemical stellt Siliziumwafer für Halbleiter, Silikonprodukte, PVC und weitere Spezialchemikalien für Elektronik-, Bau- und Industrieanwendungen her.
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