Halbleiterprozesskammer und Halbleiterprozessvorrichtung

Details

Veröffentlichungs-Nr.

EP4756073

Anmeldetag

20. August 2024

Veröffentlichung

13. März 2025

Rechtsraum

EP

Abstract

This application discloses a semiconductor process chamber and semiconductor process equipment. The semiconductor process chamber includes: a chamber body provided with an exhaust port; at least one first flow equalization plate disposed within the chamber body at a side close to the exhaust port and shielding the exhaust port, each first flow equalization plate being provided with a plurality of flow equalization holes; and a connection assembly connecting the chamber body and the first flow equalization plate, wherein the connection assembly is configured such that a distance between at least one first flow equalization plate and the exhaust port is adjustable. Embodiments of his application can maintain, as much as possible, a distance between quartz boats close to the exhaust port and the adjustable first flow equalization plate unchanged, thereby improving film thickness uniformity of silicon wafers in the quartz boats close to the exhaust port. In addition, by changing a number of first flow equalization plates, spacing between the first flow equalization plates, and a distance between the first flow equalization plates and the exhaust port, film thickness uniformity of silicon wafers in the quartz boats close to the exhaust port may be improved.

Anmelder

Firma

Beijing NAURA Microelectronics Equipment Co., Ltd.

Land

🇨🇳 China