Modulare Zwischenglieder mit Geringem Verlust
Anmelder: NXP USA, Inc. 🇺🇸
Details
- Veröffentlichungs-Nr.
- EP4756483
- Anmeldetag
- 24. November 2025
- Veröffentlichung
- 10. Juni 2026
- Rechtsraum
- EP
Abstract
Radiofrequency systems for use in advanced driver assistance systems (ADAS) can include a mixture of high frequency (e.g., above 1 GHz) analog and components and lower-frequency digital devices mounted on one main circuit board. Cost savings can be achieved by providing high-frequency signal paths on an interposer circuit board that is mounted to the main circuit board and couples devices requiring high-frequency signalling (e.g., distributing a local oscillator signal to several devices forming part of a cascaded radar system). The interposer is fabricated from special purpose materials suitable for routing high frequency signals with low loss, while the main circuit board can be fabricated from commodity materials suitable for lower frequency applications.
Anmelder
- Firma
- NXP USA, Inc.
- Land
- 🇺🇸 USA
US-amerikanische Gesellschaft des Halbleiterkonzerns NXP, die Chips und Halbleiterlösungen für Automobiltechnik, Kommunikation und Industrieelektronik entwickelt.
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