Kameramodul
Anmelder: LG INNOTEK CO. LTD 🇰🇷
Details
- Veröffentlichungs-Nr.
- EP4756530
- Anmeldetag
- 30. Juli 2024
- Veröffentlichung
- 6. Februar 2025
- Rechtsraum
- EP
- IPC
- G03B17/12, H04N23/54, G02B7/02
Abstract
The camera module includes: a first body which includes a body part and a barrel part protruding upward from the top surface of the body part, the barrel part having a hole formed on the top surface thereof; and a lens module which has at least a portion coupled to the hole and includes a barrel and a lens disposed in the barrel. The side surface of the barrel includes: a flange protruding outward more than other regions and disposed on the barrel part; and a welding part disposed between the flange and the barrel part. The barrel part includes a first region having a surface-treated outer surface, and a second region disposed on the first region without being surface-treated. The outer surface of the welding part protrudes outward more than the outer surface of the first region.
Anmelder
- Firma
- LG INNOTEK CO. LTD
- Land
- 🇰🇷 Südkorea
Südkoreanisches Elektronikunternehmen mit Sitz in Seoul, Tochtergesellschaft der LG-Gruppe. Entwickelt Komponenten für Kamera- und Optikmodule, Halbleiterträger, Motoren und Materialien für Mobilgeräte, Fahrzeuge und Displays.
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Plasseraud IP · Paris