Substratverarbeitungsvorrichtung

Details

Veröffentlichungs-Nr.

EP4756866

Anmeldetag

30. April 2024

Veröffentlichung

6. Februar 2025

Rechtsraum

EP

Abstract

A substrate processing apparatus (1) includes a substrate holder for holding a disk-like substrate (9), an electrode unit (5) facing a target portion during etching, which is part of a peripheral portion (93) of the substrate (9), and having a first electrode (51) and a second electrode (52), a processing liquid filling part (6) for forming a liquid-filled state in which a processing liquid fills a space among the target portion, the first electrode (51), and the second electrode (52) by discharging the processing liquid from a discharge port (611), a rotator for rotating the substrate (9) relative to the electrode unit (5), to thereby move the target portion in the peripheral portion (93) in a circumferential direction of the substrate (9), and a power supply (50) for applying a voltage to between the first electrode (51) and the second electrode (52). It is thereby possible to appropriately remove a metal film (96) in the peripheral portion (93) of the substrate (9).

Anmelder

Firma

SCREEN Holdings Co., Ltd.

Land

🇯🇵 Japan