Leiterplatte, Elektronische Vorrichtung und Elektronisches Modul
Anmelder: Kyocera Corporation 🇯🇵
Details
- Veröffentlichungs-Nr.
- EP4756871
- Anmeldetag
- 22. Juli 2024
- Veröffentlichung
- 6. Februar 2025
- Rechtsraum
- EP
Abstract
A wiring board (1) includes an insulating substrate (10) including a first face (11) and a hole (13) or a groove opening on the first face, a titanium oxide layer (31) located in the hole or the groove of the insulating substrate, and a conductor layer (32, 33) located on the titanium oxide layer. The hole or groove includes an inner surface. The inner surface includes a first end adjacent to the first face and a second end remote from the first face. The titanium oxide layer is located continuously from the first end to the second end of the inner surface.
Anmelder
- Firma
- Kyocera Corporation
- Land
- 🇯🇵 Japan
Japanischer Technologiekonzern mit Sitz in Kyoto. Kyocera fertigt Keramikbauteile, Halbleiterkomponenten, Solarmodule, Druck- und Kopiersysteme sowie Elektronikprodukte für Industrie und Endverbraucher.
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