Substrat und Verbindungseinheit
Anmelder: Japan Aviation Electronics Industry, Ltd. 🇯🇵
Details
- Veröffentlichungs-Nr.
- EP4757498
- Anmeldetag
- 16. Oktober 2025
- Veröffentlichung
- 10. Juni 2026
- Rechtsraum
- EP
Abstract
A substrate having flexibility is provided. A substrate (2) according to one embodiment of the present disclosure includes: a first substrate part (2a) in which a reinforcing member (12) is disposed between folded parts of a folded flexible substrate (11), the flexible substrate (11) including a first part (11a) having a cutout (11e) and a second part (11b) extending from the first part (11a), a distal end part (11i) of the second part (11b) being disposed inside the cutout (11e) of the first part (11a); a second substrate part (2b) in which a part of the flexible substrate (11) on a side of the cutout (11e) of the first part (11a) and the distal end part of the second part (11b) the flexible substrate (11) overlap a rigid substrate (13); and a flexible part (2c) disposed between the first substrate part (2a) and the second substrate part (2b) in the flexible substrate (11).
Anmelder
- Firma
- Japan Aviation Electronics Industry, Ltd.
- Land
- 🇯🇵 Japan
Japanischer Hersteller elektronischer Steckverbinder und Sensoren mit Sitz in Tokio, mehrheitlich im Besitz des Elektronikkonzerns Alps Alpine.
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