Substrat und Verbindungseinheit

EP4757498 10. Juni 2026

Anmelder: Japan Aviation Electronics Industry, Ltd. 🇯🇵

Details

Veröffentlichungs-Nr.
EP4757498
Anmeldetag
16. Oktober 2025
Veröffentlichung
10. Juni 2026
Rechtsraum
EP
Offizieller Volltext

Abstract

A substrate having flexibility is provided. A substrate (2) according to one embodiment of the present disclosure includes: a first substrate part (2a) in which a reinforcing member (12) is disposed between folded parts of a folded flexible substrate (11), the flexible substrate (11) including a first part (11a) having a cutout (11e) and a second part (11b) extending from the first part (11a), a distal end part (11i) of the second part (11b) being disposed inside the cutout (11e) of the first part (11a); a second substrate part (2b) in which a part of the flexible substrate (11) on a side of the cutout (11e) of the first part (11a) and the distal end part of the second part (11b) the flexible substrate (11) overlap a rigid substrate (13); and a flexible part (2c) disposed between the first substrate part (2a) and the second substrate part (2b) in the flexible substrate (11).

Anmelder

Firma
Japan Aviation Electronics Industry, Ltd.
Land
🇯🇵 Japan
🇯🇵 Japan Aviation Electronics Industry

Japanischer Hersteller elektronischer Steckverbinder und Sensoren mit Sitz in Tokio, mehrheitlich im Besitz des Elektronikkonzerns Alps Alpine.

725 Patente in unserer Datenbank

Vertreten von

Noch Fragen?

Wir helfen Ihnen gerne weiter. Schreiben Sie uns einfach.

Kontakt aufnehmen