Doppelseitige Chipeingebettete Leiterplatte und Herstellungsverfahren dafür

Details

Veröffentlichungs-Nr.

EP4757500

Anmeldetag

20. November 2025

Veröffentlichung

10. Juni 2026

Rechtsraum

EP

Abstract

The present disclosure relates to the technical field of vehicle parts and components, and provides a double-sided chip-embedded circuit board and a manufacturing method therefor. The double-sided chip-embedded circuit board includes: a prefabricated circuit board, with each of an upper surface and a lower surface thereof being a conductive layer; a chip packaging unit embedded in the prefabricated circuit board; an upper conductive film layer adhered to the upper surface of the prefabricated circuit board by an upper dielectric layer and covering the chip packaging unit, where an electrode of the chip packaging unit is led out to a surface of the upper conductive film layer; and a lower conductive film layer adhered to the lower surface of the prefabricated circuit board by a lower dielectric layer and exposing a backside of the chip packaging unit, where heat dissipation fins are provided on the backside of the chip packaging unit. In the present disclosure, the conductive film layer is adhered to each of the upper surface and the lower surface of the prefabricated circuit board, with the upper conductive film layer being configured for leading out of the electrode of the chip packaging unit, and the lower conductive film layer being configured for layout of other functional modules of the circuit board, such that the double-sided chip-embedded circuit board has a reasonable electrical performance layout and better stability.

Anmelder

Firma

ZF Friedrichshafen AG

Land

🇩🇪 Deutschland