Nowack, Linda

The present disclosure relates to the technical field of automotive parts, and provides an offset-chip embedded circuit board and a manufacture method therefor. The offset-chip embedded circuit board includes: a core; a chip packaging unit embedded in the core, the chip packaging unit including a conductive substrate and a chip unit embedded in the conductive substrate, wherein the chip unit is offset on a side of the conductive substrate, and an electrode lead-out area of the chip unit is reserved on the other side of the conductive substrate; a prepreg and a conductive layer stacked on the core; and lead-out wires led out from a front side of the chip packaging unit and arranged in the prepreg and the conductive layer. In the present disclosure, the chip unit is offset on a side of the conductive substrate, and the electrode lead-out area of the chip unit is reserved on the other side of the conductive substrate, such that during the formation of the offset-chip embedded circuit board, lead-out wires of electrodes of the chip unit can all be led out from the front side of the chip packaging unit, facilitating wiring.

The present disclosure relates to the technical field of vehicle parts and components, and provides a double-sided chip-embedded circuit board and a manufacturing method therefor. The double-sided chip-embedded circuit board includes: a prefabricated circuit board, with each of an upper surface and a lower surface thereof being a conductive layer; a chip packaging unit embedded in the prefabricated circuit board; an upper conductive film layer adhered to the upper surface of the prefabricated circuit board by an upper dielectric layer and covering the chip packaging unit, where an electrode of the chip packaging unit is led out to a surface of the upper conductive film layer; and a lower conductive film layer adhered to the lower surface of the prefabricated circuit board by a lower dielectric layer and exposing a backside of the chip packaging unit, where heat dissipation fins are provided on the backside of the chip packaging unit. In the present disclosure, the conductive film layer is adhered to each of the upper surface and the lower surface of the prefabricated circuit board, with the upper conductive film layer being configured for leading out of the electrode of the chip packaging unit, and the lower conductive film layer being configured for layout of other functional modules of the circuit board, such that the double-sided chip-embedded circuit board has a reasonable electrical performance layout and better stability.

The present disclosure relates to the technical field of circuit boards, and provides a chip-embedded circuit board assembly and a manufacturing method therefor. The chip-embedded circuit board assembly includes: a prefabricated circuit board; a chip packaging unit embedded in the prefabricated circuit board, where heat dissipation fins are provided on a back surface of the chip packaging unit, and the heat dissipation fins protrude outward from a lower surface of the prefabricated circuit board; and a dual-layer cooler provided below the prefabricated circuit board, the dual-layer cooler including an oil cooling cavity that is in contact with the heat dissipation fins and a water cooling cavity that is in contact with the oil cooling cavity, where interfaces of the oil cooling cavity and the water cooling cavity are exposed from the prefabricated circuit board. The heat dissipation fins are configured to improve heat dissipation performance, and the heat dissipation fins protrude outward such that the dual-layer cooler does not need to be in contact with the heat dissipation fins in an embedded manner, and it is ensured that the interfaces of the oil cooling cavity and the water cooling cavity are exposed, to facilitate piping connection. The oil cooling cavity is configured to cool the heat dissipation fins and achieve insulation protection, and the water cooling cavity is configured to cool the oil cooling cavity, thereby improving the heat conduction effect, and thus enhancing the cooling effect on the chip packaging unit and the prefabricated circuit board.

The present disclosure relates to the technical field of vehicle parts and components, and provides a multi-layer board-type chip-embedded circuit board and a manufacturing method therefor. The multi-layer board-type chip-embedded circuit board includes: a prefabricated circuit board; a chip packaging unit embedded in the prefabricated circuit board; and a plurality of groups of first conductive modules stacked below the prefabricated circuit board, the plurality of groups of first conductive modules being provided with a slot from which the chip packaging unit is exposed, such that a heat dissipation cavity is formed between a back surface of the chip packaging unit and the slot, and the heat dissipation cavity is filled with an auxiliary heat dissipation material that is in contact with the chip packaging unit and the plurality of groups of first conductive modules. According to the present disclosure, by stacking the plurality of groups of first conductive modules below the prefabricated circuit board in which the chip packaging unit is embedded, the signal transmission capability can be greatly enhanced, and the stable operation of the circuit board and stable transmission of electrical signals are ensured; and heat generated during the operation of the chip packaging unit and the first conductive modules is quickly taken away by means of the auxiliary heat dissipation material filled in the heat dissipation cavity, thereby achieving effective heat dissipation.

The present disclosure relates to the technical field of circuit boards, and provides a method for manufacturing a chip-embedded circuit board, and a chip-embedded circuit board. The method for manufacturing a chip-embedded circuit board includes: providing a mounting recess in a pre-manufactured circuit board; embedding a chip packaging unit in the mounting recess such that upper and lower surfaces of the chip packaging unit are flush with upper and lower surfaces of the pre-manufactured circuit board, respectively; and forming an electrode lead-out structure on the upper surface of the pre-manufactured circuit board by: stacking a dielectric layer and a conductive layer on the upper surface of the pre-manufactured circuit board, providing through holes in the dielectric layer and the conductive layer to expose electrodes of the chip packaging unit, and filling the through holes with a conductive material to form electrode leads of the chip packaging unit; and providing slots in a back surface of the chip packaging unit to form heat dissipation fins in such a way that the heat dissipation fins are flush with the lower surface of the pre-manufactured circuit board. The manufacturing method of the present disclosure can manufacture a chip-embedded circuit board with a robust structure that meets the operational performance and the heat dissipation performance.

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Zusammenfassung wird geladen …

Zusammenfassung wird geladen …

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