Mehrschichtige Leiterplatte mit Eingebettetem Plattenchip und Herstellungsverfahren dafür

Details

Veröffentlichungs-Nr.

EP4757501

Anmeldetag

20. November 2025

Veröffentlichung

10. Juni 2026

Rechtsraum

EP

Abstract

The present disclosure relates to the technical field of vehicle parts and components, and provides a multi-layer board-type chip-embedded circuit board and a manufacturing method therefor. The multi-layer board-type chip-embedded circuit board includes: a prefabricated circuit board; a chip packaging unit embedded in the prefabricated circuit board; and a plurality of groups of first conductive modules stacked below the prefabricated circuit board, the plurality of groups of first conductive modules being provided with a slot from which the chip packaging unit is exposed, such that a heat dissipation cavity is formed between a back surface of the chip packaging unit and the slot, and the heat dissipation cavity is filled with an auxiliary heat dissipation material that is in contact with the chip packaging unit and the plurality of groups of first conductive modules. According to the present disclosure, by stacking the plurality of groups of first conductive modules below the prefabricated circuit board in which the chip packaging unit is embedded, the signal transmission capability can be greatly enhanced, and the stable operation of the circuit board and stable transmission of electrical signals are ensured; and heat generated during the operation of the chip packaging unit and the first conductive modules is quickly taken away by means of the auxiliary heat dissipation material filled in the heat dissipation cavity, thereby achieving effective heat dissipation.

Anmelder

Firma

ZF Friedrichshafen AG

Land

🇩🇪 Deutschland