Chip-Eingebettete Leiterplattenanordnung und Herstellungsverfahren dafür

Details

Veröffentlichungs-Nr.

EP4757502

Anmeldetag

20. November 2025

Veröffentlichung

10. Juni 2026

Rechtsraum

EP

Abstract

The present disclosure relates to the technical field of circuit boards, and provides a chip-embedded circuit board assembly and a manufacturing method therefor. The chip-embedded circuit board assembly includes: a prefabricated circuit board; a chip packaging unit embedded in the prefabricated circuit board, where heat dissipation fins are provided on a back surface of the chip packaging unit, and the heat dissipation fins protrude outward from a lower surface of the prefabricated circuit board; and a dual-layer cooler provided below the prefabricated circuit board, the dual-layer cooler including an oil cooling cavity that is in contact with the heat dissipation fins and a water cooling cavity that is in contact with the oil cooling cavity, where interfaces of the oil cooling cavity and the water cooling cavity are exposed from the prefabricated circuit board. The heat dissipation fins are configured to improve heat dissipation performance, and the heat dissipation fins protrude outward such that the dual-layer cooler does not need to be in contact with the heat dissipation fins in an embedded manner, and it is ensured that the interfaces of the oil cooling cavity and the water cooling cavity are exposed, to facilitate piping connection. The oil cooling cavity is configured to cool the heat dissipation fins and achieve insulation protection, and the water cooling cavity is configured to cool the oil cooling cavity, thereby improving the heat conduction effect, and thus enhancing the cooling effect on the chip packaging unit and the prefabricated circuit board.

Anmelder

Firma

ZF Friedrichshafen AG

Land

🇩🇪 Deutschland