Verfahren zur Herstellung einer Chipeingebetteten Leiterplatte und Chipeingebettete Leiterplatte

Details

Veröffentlichungs-Nr.

EP4757503

Anmeldetag

20. November 2025

Veröffentlichung

10. Juni 2026

Rechtsraum

EP

Abstract

The present disclosure relates to the technical field of circuit boards, and provides a method for manufacturing a chip-embedded circuit board, and a chip-embedded circuit board. The method for manufacturing a chip-embedded circuit board includes: providing a mounting recess in a pre-manufactured circuit board; embedding a chip packaging unit in the mounting recess such that upper and lower surfaces of the chip packaging unit are flush with upper and lower surfaces of the pre-manufactured circuit board, respectively; and forming an electrode lead-out structure on the upper surface of the pre-manufactured circuit board by: stacking a dielectric layer and a conductive layer on the upper surface of the pre-manufactured circuit board, providing through holes in the dielectric layer and the conductive layer to expose electrodes of the chip packaging unit, and filling the through holes with a conductive material to form electrode leads of the chip packaging unit; and providing slots in a back surface of the chip packaging unit to form heat dissipation fins in such a way that the heat dissipation fins are flush with the lower surface of the pre-manufactured circuit board. The manufacturing method of the present disclosure can manufacture a chip-embedded circuit board with a robust structure that meets the operational performance and the heat dissipation performance.

Anmelder

Firma

ZF Friedrichshafen AG

Land

🇩🇪 Deutschland