Eingebettete Offset-Chip-Leiterplatte und Herstellungsverfahren dafür

Details

Veröffentlichungs-Nr.

EP4761475

Anmeldetag

5. Dezember 2025

Veröffentlichung

17. Juni 2026

Rechtsraum

EP

Abstract

The present disclosure relates to the technical field of automotive parts, and provides an offset-chip embedded circuit board and a manufacture method therefor. The offset-chip embedded circuit board includes: a core; a chip packaging unit embedded in the core, the chip packaging unit including a conductive substrate and a chip unit embedded in the conductive substrate, wherein the chip unit is offset on a side of the conductive substrate, and an electrode lead-out area of the chip unit is reserved on the other side of the conductive substrate; a prepreg and a conductive layer stacked on the core; and lead-out wires led out from a front side of the chip packaging unit and arranged in the prepreg and the conductive layer. In the present disclosure, the chip unit is offset on a side of the conductive substrate, and the electrode lead-out area of the chip unit is reserved on the other side of the conductive substrate, such that during the formation of the offset-chip embedded circuit board, lead-out wires of electrodes of the chip unit can all be led out from the front side of the chip packaging unit, facilitating wiring.

Anmelder

Firma

ZF Friedrichshafen AG

Land

🇩🇪 Deutschland