Quantenvorrichtung

Details

Veröffentlichungs-Nr.

EP4761554

Anmeldetag

8. Dezember 2025

Veröffentlichung

17. Juni 2026

Rechtsraum

EP

IPC

H10N69/00

Abstract

A quantum device (1) includes a qubit substrate (170) having qubits and conductive pads coupled to the qubits, the qubit substrate (170) having a first thermal expansion coefficient; a first support (210) having a second thermal expansion coefficient; a plurality of second supports (220) disposed between the qubit substrate (170) and the first support (210), each having a third thermal expansion coefficient a plurality of coupling members (230) each coupling the first support (210) and a corresponding second support of the second supports (220); and spring pins (310) supported by the second supports and contacting the conductive pads. A control signal for controlling a state of each of the qubits is supplied to a corresponding conductive pad of the conductive pads through a corresponding spring pin of the spring pins (310). An absolute value of a difference between the first thermal expansion coefficient and the second thermal expansion coefficient is smaller than an absolute value of a difference between the first thermal expansion coefficient and the third thermal expansion coefficient.

Anmelder

Firma

FUJITSU LIMITED

Land

🇯🇵 Japan