Ic-Gehäuse mit Kompressionsstruktur zur Befestigung von Bauteilen auf einem Gehäusesubstrat

Details

Veröffentlichungs-Nr.

EP4761559

Anmeldetag

12. Dezember 2025

Veröffentlichung

17. Juni 2026

Rechtsraum

EP

Abstract

Compact mechanisms for attaching co-packaged devices to integrated circuit (IC) packages. An example integrated circuit includes a substrate having an outer periphery; a circuit die disposed on the substrate and contained within the outer periphery; a stiffener structure that is disposed on the substrate, contained within the outer periphery, and including a threaded opening; a compression structure secured to the stiffener structure via the threaded opening; and a co-packaged device (CPD) disposed on the substrate such that a first surface portion of the CPD contacts the compression structure and such that a second surface portion of the CPD contacts the substrate.

Anmelder

Firma

Avago Technologies International Sales Pte. Limited

Land

🇸🇬 Singapur