Integrierte 3D-Schaltungsanordnung

Details

Veröffentlichungs-Nr.

EP4764766

Anmeldetag

20. Dezember 2024

Veröffentlichung

24. Juni 2026

Rechtsraum

EP

Abstract

According to an aspect, there is provided a 3D IC device comprising: a first semiconductor device tier comprising a first set of active devices; a second semiconductor device tier comprising a second set of active devices; a clock distribution network comprising a plurality of clock signal routing interconnects arranged in an interconnect structure arranged at a side of the first semiconductor device tier facing the second semiconductor device tier; and a logic circuit comprising a plurality of registers, each register comprising first active devices arranged along a data path of the register and second active devices arranged along a clock path of the register, wherein the first active devices are comprised in the first set of active devices of the first semiconductor device tier, and wherein the second active devices are comprised in the second set of active devices of the second semiconductor device tier and connected to the clock distribution network to receive a clock signal.

Anmelder

Firma

Imec VZW

Land

🇧🇪 Belgien