Lind Edlund Kenamets Intellectual Property AB
Über die Kanzlei
Lind Edlund Kenamets Intellectual Property ist in Göteborg ansässig und unterhält eine weitere Niederlassung in Lund, womit die Kanzlei über den westschwedischen Raum hinaus präsent ist. Ihr Selbstverständnis fasst die Kanzlei knapp zusammen mit dem Leitsatz „we spend our days protecting your ideas" und verbindet damit technisches Fachwissen mit anwaltlicher IP-Beratung. Neben der Patentarbeit begleitet sie auch Marken- und Designschutz sowie IP-Streitigkeiten, etwa im Bereich Pharma und Life Sciences, und betreut Mandanten aus Elektrotechnik, Software, Medizintechnik, Life Sciences, Cleantech sowie Chemie und Materialwissenschaften.
Kontaktdaten
411 36 Göteborg
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Standorte
2Aktuelle Patente
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16.09.2026 · Inovacijos Sportui, MB
Zeitverfolgungsvorrichtung
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Status
Angemeldet am 11.03.2025
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Vertretung
Zusammenfassung
The present invention relates to a time tracking apparatus and a time tracking system for determining a track time of a moving object on a travelling path, the time tracking system comprising at least two time tracking apparatuses. The invention further relates to a method of determining a track time of the moving object. |
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16.09.2026 · Imec VZW
Verfahren zur Herstellung einer Verbindungsstruktur
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Angemeldet am 14.03.2025
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Vertretung
Zusammenfassung
There is provided a method for forming an interconnect structure for an integrated circuit device, the method comprising: forming a workpiece for a second interconnect layer on a sacrificial substrate, wherein the workpiece comprises at least a first workpiece metal layer epitaxially grown on a growth surface of the sacrificial substrate; bonding the workpiece to an initial interconnect structure of a device wafer, the initial interconnect structure comprising a first interconnect layer surrounded by an interlayer dielectric layer; subsequent to the bonding, removing the sacrificial substrate from the first workpiece metal layer; and patterning the workpiece comprising the first workpiece metal layer to form a second interconnect layer over the first interconnect layer. |
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02.09.2026 · Aros Electronics AB
Stromrichtervorrichtung mit Integriertem Steuerungsschema
Elektrische Energietechnik
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Angemeldet am 27.02.2025
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Zusammenfassung
The present disclosure relates to systems and methods for controlling and compensating reactive power consumption in an electricity distribution network by means of one or more power converter devices. Each power converter device may be configured to provide active power to a respective power consumer such as a mechanical load. The systems and methods herein further pertain to mitigating voltage harmonic components in the electricity distribution network by means of the one or more power converter devices. A distributed control system comprising a plurality of power converter devices for counteracting reactive power consumption and/or harmonic mitigation in the electricity distribution network has also been disclosed. |
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26.08.2026 · ICEpower a/s
Oberflächenmontierbarer Wärmeableiter zur Wärmeableitung von einem Wärmeerzeugenden Bauelement auf einer Leiterplatte
Halbleiter & Elektrische Bauelemente
Elektronik & Schaltungstechnik
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Angemeldet am 19.02.2025
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Zusammenfassung
A surface mountable heat dissipator configured to be in thermal contact with a designated heat generating component such as a transistor on a printed circuit board the heat dissipator is formed by a strip of sheet metal bent into a loop, two ends of the bent strip of sheet metal are joined to render the loop a closed loop a mounting portion of the bent strip of sheet metal is substantially flat, and is configured to be surface mounted. A closed loop of relatively thin metal gives the heat dissipator satisfactory mechanical stability with a relatively small amount of material, thereby reducing manufacturing costs and mass. The low mass ensures that only a low amount of force is exerted upon the heat dissipator and its solder joins when it is subject to external shocks and vibrations. This increases robustness and lifetime of the overall product implementing the heat dissipator. |
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26.08.2026 · Laird Technologies, Inc.
Dreidimensionale (3D) Thermische Verbindungen mit Rheologiegesteuerten Thermischen Grenzflächenmaterialien (tims)
Farben, Klebstoffe & Brennstoffe
Halbleiter & Elektrische Bauelemente
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Status
Angemeldet am 20.02.2026
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Vertretung
Zusammenfassung
Disclosed are exemplary methods for forming three-dimensional (3D) thermal joints using thermal interface materials (TIMs), e.g., metal amalgams, low melting alloys, liquid metals, rheology controlled TIMs, etc. Also disclosed are exemplary embodiments of three-dimensional (3D) thermal joints including TIMs, e.g., metal amalgams, low melting alloys, liquid metals, rheology controlled TIMs, etc. The 3D thermal joint may be used to fill in gap(s) between a heat source(s) and another component(s) of an electronic device. For example, the 3D thermal joint may be used to fill in the gaps between multiple heat sources of varying heights (e.g., integrated circuit (IC) components of varying heights, 2D processor, 2.5D processor, 3D processor, chiplet segmented processor, other component(s) having multiple heights, etc.) and a heat removal/dissipation component (e.g., a heat sink, a heat spreader, a heat pipe, a vapor chamber, a water block, a device exterior case, a housing, a chassis, etc.). |
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19.08.2026 · Imec VZW
Verfahren zum Entwurf einer Integrierten Schaltung
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Angemeldet am 18.02.2025
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Zusammenfassung
In an aspect there is provided a computer-implemented method for designing an IC comprising CFET devices. The method comprises obtaining a functional description of the integrated circuit, and generating, based on the functional description, a layout of the integrated circuit. The layout defines first and second cell rows extending in parallel in a horizontal direction of the layout, and having equal row heights in a vertical direction of the layout. Generating the layout comprises placing first and second cells of a standard cell library in the layout. Each cell has a cell height equal to the row height, and comprises first and second cell edges extending in parallel in the horizontal direction. Each cell further comprises at least one CFET device having an active pattern extending in the horizontal direction. Each cell further comprises at least one local interconnect (LI) disposed on the second cell edge and configured to connect to a top and/or bottom S/D of a CFET device of the cell. The first and second cells are placed in the first and second cell rows, respectively, such that: the first cell edge of the first cell aligns with a first row boundary, the first cell edge of the second cell aligns with a second row boundary, and the second cell edges of the first and second cells align with and abut each other along a third row boundary between the first and second cell rows. The placement of the first and second cells is constrained such that the local interconnects of the first and second cells do not overlap. |
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22.07.2026 · Spacerpad AB
Anordnung und Verfahren zur Herstellung Waschbarer Wiederverwendbarer Hygieneprodukte
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Angemeldet am 20.01.2025
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Vertretung
Zusammenfassung
An arrangement for producing a reusable hygiene product comprising a baseplate (5) and at least one mold (7) comprising a central indentation (42) facing the baseplate (5) and a substantially flat section (44) surrounding the indentation (42). The baseplate (5) and at least one mold (7) are configured to be heated to an elevated temperature, and are displaceable to a position in which the mold (7) is in proximity with the base plate (5). The arrangement further comprises a tray (3) comprising at least one compartment (24) having a heat transmissive floor (25) configured to support a stack (30) of layers. The tray (3) can be inserted between the mold (7) and the baseplate (5), allowing the stack (30) to be heat sealed. |
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15.07.2026 · Laird Technologies, Inc.
Wärmeverwaltungsanordnungen für Gleitanwendungen
Halbleiter & Elektrische Bauelemente
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Angemeldet am 08.01.2026
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Zusammenfassung
Exemplary embodiments are disclosed of thermal management assemblies or thermal solutions (e.g., with improved durability, etc.) for sliding applications. In exemplary embodiments, the thermal management assembly or thermal solution is robust and improves heat transfer between a slidable heat source and a stationary heat sink via a durable layer (e.g., metal wear-resistant layer defined by a stainless steel, copper, beryllium copper, aluminum, brass, other metal substrate or cover, other materials with high thermal conductivity and puncture resistant in addition to wear-resistant, etc.) disposed over or along a thermal interface material (broadly, interface material) (e.g., thermal phase change material (PCM), etc.), thereby providing a durable, slide-resistant thermal interface material (TIM) with improved performance over conventional thermal solutions. |
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08.07.2026 · Oohms NY LLC
System und Verfahren zur Verteilung Digitaler Medieninhalte auf Tablet-Basis
Software & Datenverarbeitung
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Angemeldet am 22.01.2020
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Vertretung
Zusammenfassung
A method for distributing media content and tracking viewer impressions in an out-of-home context includes: a mobile computing device receiving an identifier of a first media content item; causing display of the first media content item to a first viewer; sensing image data of the first viewer during display of the first media content item; determining a location of the mobile computing device during display of the first media content item to the first viewer; sending the image data of the first viewer, and an impression-reporting message including: the identifier of the first media content item and the location of the mobile computing device during display of the first media content item to the first viewer. |
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01.07.2026 · Starsprings AB
Taschenfederkernmatratze mit Randstütze
Haushalts-, Möbel- & Konsumgüter
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Angemeldet am 27.12.2024
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Vertretung
Zusammenfassung
A pocket spring mattress (1) is disclosed, comprising a plurality of strings (2a, 2b) of springs (4) , each string (2a, 2b) joined to at least one adjacent string (2a, 2b), the strings (2a, 2b) including strings (2a, 2b) of a first type and strings (2a, 2b) of a second type, each of said strings (2a, 2b) comprising first and second opposed plies of fabric (3) and a plurality of pockets formed along a length of the string (2a, 2b) by transverse seams joining the first and second plies, at least some of the pockets accommodating a spring. The strings (2a, 2b) of the first type have a first linear density of springs (4) and the strings (2a, 2b) of the second type have, at least in a section thereof and preferably over their entire length, a second linear density of springs (4), the second density of springs (4) being greater than the first linear density of springs (4). The strings (2a, 2b) of the section type may e.g. be arranged around an edge or perimeter of the mattress (1), or in zones of increased firmness. Each string (2a, 2b) of the second type comprises at least one stabilizing fabric (5) strip (5) connected to the fabric (3) of the string (2a, 2b) over at least a part of the extension of the string (2a, 2b), the stabilizing fabric (5) strip(s) being arranged to extend solely along a surface of the string (2a, 2b). |
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