Lind Edlund Kenamets Intellectual Property AB

An arrangement for producing a reusable hygiene product comprising a baseplate (5) and at least one mold (7) comprising a central indentation (42) facing the baseplate (5) and a substantially flat section (44) surrounding the indentation (42). The baseplate (5) and at least one mold (7) are configured to be heated to an elevated temperature, and are displaceable to a position in which the mold (7) is in proximity with the base plate (5). The arrangement further comprises a tray (3) comprising at least one compartment (24) having a heat transmissive floor (25) configured to support a stack (30) of layers. The tray (3) can be inserted between the mold (7) and the baseplate (5), allowing the stack (30) to be heat sealed.

Exemplary embodiments are disclosed of thermal management assemblies or thermal solutions (e.g., with improved durability, etc.) for sliding applications. In exemplary embodiments, the thermal management assembly or thermal solution is robust and improves heat transfer between a slidable heat source and a stationary heat sink via a durable layer (e.g., metal wear-resistant layer defined by a stainless steel, copper, beryllium copper, aluminum, brass, other metal substrate or cover, other materials with high thermal conductivity and puncture resistant in addition to wear-resistant, etc.) disposed over or along a thermal interface material (broadly, interface material) (e.g., thermal phase change material (PCM), etc.), thereby providing a durable, slide-resistant thermal interface material (TIM) with improved performance over conventional thermal solutions.

A method for distributing media content and tracking viewer impressions in an out-of-home context includes: a mobile computing device receiving an identifier of a first media content item; causing display of the first media content item to a first viewer; sensing image data of the first viewer during display of the first media content item; determining a location of the mobile computing device during display of the first media content item to the first viewer; sending the image data of the first viewer, and an impression-reporting message including: the identifier of the first media content item and the location of the mobile computing device during display of the first media content item to the first viewer.

A pocket spring mattress (1) is disclosed, comprising a plurality of strings (2a, 2b) of springs (4) , each string (2a, 2b) joined to at least one adjacent string (2a, 2b), the strings (2a, 2b) including strings (2a, 2b) of a first type and strings (2a, 2b) of a second type, each of said strings (2a, 2b) comprising first and second opposed plies of fabric (3) and a plurality of pockets formed along a length of the string (2a, 2b) by transverse seams joining the first and second plies, at least some of the pockets accommodating a spring. The strings (2a, 2b) of the first type have a first linear density of springs (4) and the strings (2a, 2b) of the second type have, at least in a section thereof and preferably over their entire length, a second linear density of springs (4), the second density of springs (4) being greater than the first linear density of springs (4). The strings (2a, 2b) of the section type may e.g. be arranged around an edge or perimeter of the mattress (1), or in zones of increased firmness. Each string (2a, 2b) of the second type comprises at least one stabilizing fabric (5) strip (5) connected to the fabric (3) of the string (2a, 2b) over at least a part of the extension of the string (2a, 2b), the stabilizing fabric (5) strip(s) being arranged to extend solely along a surface of the string (2a, 2b).

According to an aspect, there is provided a 3D IC device comprising:a first semiconductor device tier comprising a first set of active devices;a second semiconductor device tier comprising a second set of active devices;a clocked circuit comprising first active devices comprised in the first set of active devices of the first semiconductor device tier; anda clock distribution network comprising a plurality of clock signal routing interconnects arranged in an interconnect structure arranged at a side of the first semiconductor device tier facing the second semiconductor device tier, and a set of active clock devices formed by second active devices comprised in the second set of active devices of the second semiconductor device tier;wherein the clocked circuit is connected to the clock distribution network to receive a clock signal

According to an aspect, there is provided a 3D IC device comprising: a first semiconductor device tier comprising a first set of active devices; a second semiconductor device tier comprising a second set of active devices; a clock distribution network comprising a plurality of clock signal routing interconnects arranged in an interconnect structure arranged at a side of the first semiconductor device tier facing the second semiconductor device tier; and a logic circuit comprising a plurality of registers, each register comprising first active devices arranged along a data path of the register and second active devices arranged along a clock path of the register, wherein the first active devices are comprised in the first set of active devices of the first semiconductor device tier, and wherein the second active devices are comprised in the second set of active devices of the second semiconductor device tier and connected to the clock distribution network to receive a clock signal.

In an aspect there is provided a 3D IC, comprising:a stack of device tiers comprising a first and a second device tier;a data processing circuit comprising a set of launch and capture circuits, and a set of processing stages,wherein each processing circuit is connected between a launch circuit and a capture circuit,wherein the data processing circuit is partitioned between the first and second device tiers such that the set of launch and capture circuits is arranged in the first device tier and the set of processing stages is arranged in the second device tier.

The present invention relates to a nut connection arrangement (100) comprising: a threaded shaft (110) comprising a plurality of splines (112), a castellated nut (120) comprising a plurality of crenellation slots (122) and a locking member (130). The locking member comprising at least one radially inwardly extending protrusion (132) configured to engage a spline (112) and at least one radially outwardly extending protrusion (134) configured to engage a crenellation slot (122). The number and an angular distribution of the crenellation slots (122) and the splines (112) are such that, irrespective of a rotational position of the castellated nut (120) in relation to the shaft (110) when the castellated nut (120) is threaded onto the shaft (110), for at least one rotational position of the locking member (130), the locking member (130) is slidable onto the shaft (110) such that the at least one radially inwardly extending protrusion (132) and the at least one radially outwardly extending protrusion (134) engage with the splines (112) and the crenellation slots (122), respectively, thereby providing a rotational locking of the castellated nut (130) in relation to the shaft (110). A truck coupling (10), a draw beam arrangement (11), a truck (1) and a method (200) for rotationally locking a castellated nut (120) in relation to a threaded shaft (110) are also provided.

Disclosed are geotextiles configured for moisture management. In exemplary embodiments, a geotextile comprises a plurality of structural elements including one or more yarns, cords, or filament bundles arranged to form a fabric or grid. At least a portion of the structural elements include capillary-active surfaces and/or are configured to promote capillary wicking of moisture along at least one direction of the geotextile. At least a portion of the structural elements include internal void regions configured to maintain hydraulic conductivity under compaction. The geotextile is operable for providing dual-mode moisture transport through both capillary wicking and hydraulic flow thereby allowing for removal and redistribution of water from pavement layers and subgrade soils.

In an aspect there is provided a semiconductor device comprising:a first and second power rail structure extending in parallel, each comprising a bottom power rail and a top power rail arranged above the bottom power rail;a row of local interconnects arranged between and extending in parallel to the first and second rows of CFET devices;a first and second row of complementary field-effect transistor, CFET, devices extending in parallel to the first and second power rail structures, wherein the first row of CFET devices is arranged between the first power rail structure and the row of local interconnects, and the second row of CFET devices is arranged between the second power rail structure and the row of local interconnects;a logic cell comprisingat least one CFET device of the first row of CFET devices configured to implement a first logic gate, and a first local interconnect of the row of local interconnects configured to interconnect a top and bottom source/drain, S/D, of a first CFET device of the at least one CFET device of the first row of CFET devices; andat least one CFET device of the second row of CFET devices configured to implement a second logic gate, and a second local interconnect of the row of local interconnects configured to interconnect a top and bottom S/D of a second CFET device of the at least one CFET device of the second row of CFET devices,wherein the first logic gate is connected to first input and output pins of the logic cell and the second logic gate is connected to second input and output pins of the logic cell, andwherein the first power rail structure is configured to power the first logic gate and the second power rail structure is configured to power the second logic gate.