3D-Ic und Verfahren zur Herstellung eines 3D-Ic

Details

Veröffentlichungs-Nr.

EP4765646

Anmeldetag

20. Dezember 2024

Veröffentlichung

24. Juni 2026

Rechtsraum

EP

IPC

H03K19/0175, // H01L25/065

Abstract

In an aspect there is provided a 3D IC, comprising:a stack of device tiers comprising a first and a second device tier;a data processing circuit comprising a set of launch and capture circuits, and a set of processing stages,wherein each processing circuit is connected between a launch circuit and a capture circuit,wherein the data processing circuit is partitioned between the first and second device tiers such that the set of launch and capture circuits is arranged in the first device tier and the set of processing stages is arranged in the second device tier.

Anmelder

Firma

Imec VZW

Land

🇧🇪 Belgien

Fachgebiete