Leiterplatte und Elektronische Vorrichtung

Details

Veröffentlichungs-Nr.

EP4766030

Anmeldetag

30. Juli 2024

Veröffentlichung

3. Juli 2025

Rechtsraum

EP

IPC

H05K1/02

Abstract

This application relates to the technical field of electronic devices, and discloses a circuit board and an electronic device. The electronic device includes the circuit board, a rotating shaft mechanism, a first body, and a second body. The first body and the second body are rotatably connected through a connection assembly of the rotating shaft mechanism, and can rotate relative to each other about an axis extending along a first direction. The circuit board includes a first extension segment, a connection segment, and a second extension segment that are successively connected. The first extension segment and the second extension segment respectively extend to the first body and the second body. The connection segment extends through the rotating shaft mechanism, and the connection segment includes a first sub-segment and a second sub-segment that are disposed at an interval along the first direction. The first sub-segment and the second sub-segment both connect the first extension segment and the second extension segment, and are located along the first direction on opposite sides of the center of the electronic device along the first direction. The connection assembly of the rotating shaft mechanism includes a first connection assembly, and the first connection assembly is disposed between the first sub-segment and the second sub-segment along the first direction, thereby enhancing strength of the electronic device.

Anmelder

Firma

Honor Device Co., Ltd.

Land

🇨🇳 China