Ausgekleideter Hohlraumabstandshalter für Gate-All-Around-Transistor
Anmelder: INTEL Corporation 🇺🇸
Details
- Veröffentlichungs-Nr.
- EP4766075
- Anmeldetag
- 28. November 2025
- Veröffentlichung
- 24. Juni 2026
- Rechtsraum
- EP
- IPC
- H10D30/00, // H10D30/01
Abstract
Described herein are nanoribbon transistors with lined cavity spacers deposited near the ends of the nanoribbons, including between the ends of adjacent nanoribbons. The cavity spacers include a liner layer next to the gate stack, and a fill material nested within the liner layer and adjacent to the source or drain. The liner layer is a non-oxide dielectric. For example, the liner may be a low-k nitride. The liner layer may be conformally deposited, and a portion of the liner layer may extend between the gate stack and the source or drain. Using a non-oxide material prevents removal of the liner during an oxide clean step prior to nanoribbon release.
Anmelder
- Firma
- INTEL Corporation
- Land
- 🇺🇸 USA
US-amerikanischer Halbleiterhersteller mit Sitz in Kalifornien. Entwickelt und produziert Prozessoren, Chipsätze sowie weitere Halbleiterkomponenten für Computer, Server und eingebettete Systeme.
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