Halbleiteranordnung mit einer Kondensatorstruktur Neben einem Aktiven Halbleitergebiet
Anmelder: NXP USA, Inc. 🇺🇸
Details
- Veröffentlichungs-Nr.
- EP4766135
- Anmeldetag
- 15. Dezember 2025
- Veröffentlichung
- 24. Juni 2026
- Rechtsraum
- EP
Abstract
A semiconductor device configured to reduce the size of passive components monolithically integrated with active components includes a semiconductor substrate that includes an active region, a first current-carrying electrode formed in the active region, a second current-carrying electrode formed in the active region, a control electrode configured to control current flow between the first current-carrying electrode and the second current-carrying electrode. A capacitor structure is formed over the semiconductor substrate adjacent the active region. The capacitor structure includes a first capacitor region that includes a portion of a first conductive layer formed over the semiconductor substrate. A first insulating layer is formed over the first capacitor region. A second capacitor region that includes a portion of a second conductive layer is formed over the first insulating layer. In an embodiment, a contact area is coupled to the capacitor structure.
Anmelder
- Firma
- NXP USA, Inc.
- Land
- 🇺🇸 USA
US-amerikanische Gesellschaft des Halbleiterkonzerns NXP, die Chips und Halbleiterlösungen für Automobiltechnik, Kommunikation und Industrieelektronik entwickelt.
1.545 Patente in unserer Datenbank