Halbleiteranordnung mit einer Kondensatorstruktur Neben einem Aktiven Halbleitergebiet

EP4766135 24. Juni 2026

Anmelder: NXP USA, Inc. 🇺🇸

Details

Veröffentlichungs-Nr.
EP4766135
Anmeldetag
15. Dezember 2025
Veröffentlichung
24. Juni 2026
Rechtsraum
EP
Offizieller Volltext

Abstract

A semiconductor device configured to reduce the size of passive components monolithically integrated with active components includes a semiconductor substrate that includes an active region, a first current-carrying electrode formed in the active region, a second current-carrying electrode formed in the active region, a control electrode configured to control current flow between the first current-carrying electrode and the second current-carrying electrode. A capacitor structure is formed over the semiconductor substrate adjacent the active region. The capacitor structure includes a first capacitor region that includes a portion of a first conductive layer formed over the semiconductor substrate. A first insulating layer is formed over the first capacitor region. A second capacitor region that includes a portion of a second conductive layer is formed over the first insulating layer. In an embodiment, a contact area is coupled to the capacitor structure.

Anmelder

Firma
NXP USA, Inc.
Land
🇺🇸 USA
🇺🇸 NXP USA

US-amerikanische Gesellschaft des Halbleiterkonzerns NXP, die Chips und Halbleiterlösungen für Automobiltechnik, Kommunikation und Industrieelektronik entwickelt.

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