Halbleiteranordnung mit einem Gewickelten Fingerelement

Details

Veröffentlichungs-Nr.

EP4766136

Anmeldetag

18. Dezember 2025

Veröffentlichung

24. Juni 2026

Rechtsraum

EP

Abstract

An integrated circuit device is disclosed which has a substrate layer with input and output terminals and an array of FET elements formed over a top surface of the substrate layer, where each FET element includes an elongated source contact with opposed sides extending longitudinally between a first source end that is proximate to the output terminal layer and a second source end that is proximate to the input terminal; a U-shaped drain contact positioned to enclose the first source end and located to define a U-shaped channel region between the elongated source contact and the U-shaped drain contact; and a U-shaped gate contact positioned over the U-shaped channel region and between the U-shaped drain contact and the elongated source contact, where the U-shaped gate contact and U-shaped drain contact each have a closed end located in the peripheral ancillary region between the first source end and the output terminal.

Anmelder

Firma

NXP USA, Inc.

Land

🇺🇸 USA