Verpackungssubstrate mit Komponenten in Hohlräumen von Glaskernen

Details

Veröffentlichungs-Nr.

EP4766137

Anmeldetag

24. November 2025

Veröffentlichung

24. Juni 2026

Rechtsraum

EP

Abstract

Package substrates with components included in cavities of glass cores are disclosed. An example apparatus includes: a glass layer having a first hole and a second hole, the second hole larger than an electronic component disposed therein, a width of the electronic component larger than a width of the first hole. The example apparatus further includes a conductive material that substantially fills the first hole; and a dielectric material that substantially fills a space within the second hole surrounding the electronic component.

Anmelder

Firma

INTEL Corporation

Land

🇺🇸 USA