Integrierte Schaltungspackung mit Doppelseitiger Signalleitstruktur

Details

Veröffentlichungs-Nr.

EP4766139

Anmeldetag

28. November 2025

Veröffentlichung

24. Juni 2026

Rechtsraum

EP

Abstract

A system and method provides a substrate having a first surface and a second surface. A first plurality of contact pads are formed on the first surface of the substrate. A first redistribution layer is formed over the first surface of the substrate by mounting a plurality of metal balls to contact pads of the first plurality of contact pads on the first surface of the substrate, wherein the plurality of metal balls include copper, forming a layer of encapsulant surrounding at least a portion of the plurality of metal balls, depositing a dielectric layer over the plurality of metal balls and the encapsulant, and forming a second plurality of contact pads over the dielectric layer, wherein each contact pad of the second plurality of contact pads is connected through openings in the dielectric layer to metal balls of the plurality of metal balls.

Anmelder

Firma

NXP USA, Inc.

Land

🇺🇸 USA