Wärmeableitungssystem und -Verfahren sowie zu Kühlende Vorrichtung, Elektronische Vorrichtung und Speichermedium

Details

Veröffentlichungs-Nr.

EP4770293

Anmeldetag

15. August 2024

Veröffentlichung

3. April 2025

Rechtsraum

EP

IPC

H05K7/20

Abstract

Provided in the embodiments of the present disclosure are a heat dissipation system and method, and a device to be cooled, an electronic device and a storage medium. The system comprises: a piezoelectric heat dissipation apparatus (1), a natural heat dissipation apparatus (2), a temperature sensor (3) and a control unit (4), wherein the piezoelectric heat dissipation apparatus (1) and the natural heat dissipation apparatus (2) are arranged on a heat source (5), and the control unit (4) is electrically connected to the temperature sensor (3) and the piezoelectric heat dissipation apparatus (1); the temperature sensor (3) measures the temperature of the heat source; the natural heat dissipation apparatus (2) performs natural heat dissipation; the piezoelectric heat dissipation apparatus (1) performs natural heat dissipation and performs airflow heat dissipation by means of a piezoelectric effect; and the control unit (4) acquires the temperature of the heat source, controls, when the temperature of the heat source is greater than or equal to a preset temperature threshold, the piezoelectric heat dissipation apparatus (1) to operate and to generate an airflow so as to make the natural heat dissipation apparatus (2) and the piezoelectric heat dissipation apparatus (1) perform airflow heat dissipation, and controls, when the temperature of the heat source is less than the temperature threshold, the piezoelectric heat dissipation apparatus (1) to stop operating so as to make the natural heat dissipation apparatus (2) and the piezoelectric heat dissipation apparatus (1) perform natural heat dissipation.

Anmelder

Firma

ZTE CORPORATION

Land

🇨🇳 China