Halbleitervorrichtung und Verfahren zu deren Herstellung
Anmelder: SK hynix Inc. 🇰🇷
Details
- Veröffentlichungs-Nr.
- EP4770305
- Anmeldetag
- 27. November 2025
- Veröffentlichung
- 1. Juli 2026
- Rechtsraum
- EP
Abstract
A method for fabricating a semiconductor device including high-integrated memory cells and the semiconductor device is provided. The method includes forming a horizontal arrangement of nano sheet target patterns over a substrate, wherein the nano sheet target patterns include initial sheets that are horizontally oriented and sheet expansion tabs disposed on both sides of each of the initial sheets; performing a surface treatment on the nano sheet target patterns to form a horizontal arrangement of narrow sheets and nano sheet dielectric layers, each of the nano sheet dielectric layers surrounding a different one of the narrow sheets; and forming a horizontal conductive line on the nano sheet dielectric layers, the horizontal conductive line surrounding the narrow sheets.
Anmelder
- Firma
- SK hynix Inc.
- Land
- 🇰🇷 Südkorea
Südkoreanischer Halbleiterhersteller, der Speicherchips wie DRAM und NAND-Flash für Computer, Server und mobile Geräte produziert.
59 Patente in unserer Datenbank
Vertreten von
-
Isarpatent
Isarpatent · München