Substratverarbeitungsvorrichtung und Substratverarbeitungsverfahren

Details

Veröffentlichungs-Nr.

EP4770402

Anmeldetag

15. Dezember 2025

Veröffentlichung

1. Juli 2026

Rechtsraum

EP

IPC

H10P72/00

Abstract

A substrate processing apparatus includes a nozzle device having a liquid discharger, a fluid supply system that supplies a processing liquid having a surface tension lower than that of a residual liquid to the nozzle device, a horizontal-direction driving device that moves the nozzle device to a plurality of different portions in a radial direction of a substrate in plan view while keeping the nozzle device at a position above the rotating substrate, and a controller that controls the fluid supply system and the horizontal-direction driving device according to a liquid processing condition. A liquid processing condition includes a liquid flow-rate condition that defines a flow rate of a processing liquid to be supplied to the nozzle device in each of the plurality of portions of the substrate, and a liquid movement condition that defines a movement speed of the nozzle device when the nozzle device moves to each of the plurality of portions of the substrate in order to supply the processing liquid to each of the plurality of portions of the substrate.

Anmelder

Firma

SCREEN Holdings Co., Ltd.

Land

🇯🇵 Japan

Fachgebiete