Halbleitergehäusestruktur

Details

Veröffentlichungs-Nr.

EP4770410

Anmeldetag

2. Juli 2024

Veröffentlichung

1. Juli 2026

Rechtsraum

EP

Abstract

A semiconductor package structure includes a package substrate and a semiconductor die. The package substrate includes a core structure, an integrated capacitor structure, and a redistribution layer. The integrated capacitor structure is embedded in the core structure. The redistribution layer is disposed over the integrated capacitor structure. The semiconductor die is disposed over the package substrate and is thermally coupled to the integrated capacitor structure through the redistribution layer.

Anmelder

Firma

MediaTek Inc.

Land

🇹🇼 Taiwan