Leitfähige Flüssigmetallmatrix

Details

Veröffentlichungs-Nr.

EP4770412

Anmeldetag

25. November 2025

Veröffentlichung

1. Juli 2026

Rechtsraum

EP

IPC

H10W70/66

Abstract

Embodiments disclosed herein include an apparatus that comprises a first substrate with a first pad on the first substrate, where the first pad is electrically conductive, and a second substrate over the first substrate with a second pad on the second substrate, where the second pad is electrically conductive. In an embodiment, the apparatus further comprises a patch between the first substrate and the second substrate. In an embodiment, the patch comprises a frame with an opening through the frame, and an interconnect within the opening. In an embodiment, the interconnect electrically couples the first pad to the second pad, and the interconnect comprises a liquid metal matrix with filler particles that are electrically conductive.

Anmelder

Firma

INTEL Corporation

Land

🇺🇸 USA

Fachgebiete