Leistungsverstärkeranordnungen und Mehrstufige Verstärkersysteme
Anmelder: NXP USA, Inc. 🇺🇸
Details
- Veröffentlichungs-Nr.
- EP4770417
- Anmeldetag
- 24. November 2025
- Veröffentlichung
- 1. Juli 2026
- Rechtsraum
- EP
Abstract
Power amplifier assemblies and multiple-stage amplifier systems include first and second semiconductor dies, each of which includes an integrated transistor. The second semiconductor die is physically and electrically coupled to a die-mounting interface at a mounting surface of the first semiconductor die in a "flip-chip" orientation. This arrangement provides a multiple-stage amplifier that includes the integrated transistor of the first semiconductor die coupled in a cascade arrangement with the integrated transistor of the second semiconductor die. The first and second semiconductor dies may be formed from different semiconductor materials.
Anmelder
- Firma
- NXP USA, Inc.
- Land
- 🇺🇸 USA
US-amerikanische Gesellschaft des Halbleiterkonzerns NXP, die Chips und Halbleiterlösungen für Automobiltechnik, Kommunikation und Industrieelektronik entwickelt.
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