Anordnung für Haptische Rückmeldung und Vorrichtung für Haptische Rückmeldung

Details

Veröffentlichungs-Nr.

EP4772967

Anmeldetag

28. Dezember 2023

Veröffentlichung

3. Juli 2025

Rechtsraum

EP

IPC

G06F3/01

Abstract

Embodiments of the present disclosure provide a haptic feedback assembly and a haptic feedback device. The haptic feedback assembly includes: a flexible circuit board, where the flexible circuit board includes a flexible substrate, a first metal layer arranged on a side of a first surface of the flexible substrate, and a second metal layer arranged on a side of a second surface of the flexible substrate, and the first surface and the second surface are oppositely arranged in a thickness direction of the flexible substrate; and a plurality of piezoelectric actuators, arranged on a side of the first metal layer away from the flexible substrate, where the piezoelectric actuators are electrically connected with the first metal layer, the first metal layer is electrically connected with the second metal layer through a through hole penetrating the flexible substrate, the second metal layer is electrically connected with an external driving circuit.

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Firmen

Boe Technology Group Co., Ltd.
Beijing BOE Technology Development Co., Ltd.

Land

🇨🇳 China

Fachgebiete