Substratverarbeitungsverfahren

Details

Veröffentlichungs-Nr.

EP4773170

Anmeldetag

19. August 2024

Veröffentlichung

6. März 2025

Rechtsraum

EP

IPC

H01L21/304

Abstract

Provided is a technology that can effectively reduce a pattern collapse ratio of a substrate. A method of processing a substrate includes a holding step, a liquid supplying step, a first drying liquid supplying step, a second drying liquid supplying step, and a drying step. In the first drying liquid supplying step, a first drying liquid having a first boiling point (bp1) and a surface tension lower than that of the processing liquid is supplied to a first main surface of the substrate. In the second drying liquid supplying step, a second drying liquid having a second boiling point (bp2) and a surface tension lower than that of the first drying liquid is supplied to the first main surface of the substrate. In the drying step, the substrate is dried. A second main surface of the substrate is heated to a first temperature in at least a part of a time in the first drying liquid supplying step, and at least a part of the second main surface of the substrate is heated to a second temperature, in at least a part of a time in the second drying liquid supplying step. A positive or negative sign of a value obtained by subtracting the second temperature from the first temperature is identical to a positive or negative sign of a value obtained by subtracting the second boiling point (bp2) from the first boiling point (bp1).

Anmelder

Firma

SCREEN Holdings Co., Ltd.

Land

🇯🇵 Japan

Fachgebiete