Halbleiterpackung und Verfahren zu Ihrer Herstellung

Details

Veröffentlichungs-Nr.

EP4773185

Anmeldetag

6. Januar 2025

Veröffentlichung

8. Juli 2026

Rechtsraum

EP

IPC

H01L23/473, H01L23/46

Abstract

The present specification relates to package semiconductor devices and methods of manufacture thereof. According to a first aspect of the present disclosure, there is provided a packaged semiconductor device comprising a semiconductor die, a first molding compound encapsulating the semiconductor die, a first set of interconnecting solder balls, at least one redistribution layer, such redistribution layer connecting the semiconductor die to the interconnecting solder balls. The packaged semiconductor device further comprises at least one channel extending from the at least one redistribution layer to an exterior of the packaged semiconductor device wherein the at least one redistribution layer comprises pipes coupled to the at least one channel, such pipes transporting steam or moisture or thermal fluids from the at least one channel to the at least one redistribution layer or from the at least one redistribution layer to the at least one channel.

Anmelder

Firma

NXP USA, Inc.

Land

🇺🇸 USA

Fachgebiete