Schaltungsanordnung und Vorrichtung mit Radiofrequenzkontakten

Details

Veröffentlichungs-Nr.

EP4773429

Anmeldetag

6. Januar 2025

Veröffentlichung

8. Juli 2026

Rechtsraum

EP

Abstract

A circuit assembly includes a packaged electronic device having an RF (radio frequency) contact and a shield contact. The circuit assembly further includes a substrate coupled to the packaged electronic device and at least partially containing an inner conductive structure electrically coupled to the RF contact and an outer conductive structure electrically coupled to the shield contact, the inner conductive structure and the outer conductive structure forming a vertical coaxial structure through the substrate. The circuit assembly still further includes a waveguide antenna electrically coupled to the coaxial structure on a side of the substrate opposite the packaged electronic device. Further embodiments are directed to a device suitable for use in a circuit assembly as described above.

Anmelder

Firma

NXP B.V.

Land

🇳🇱 Niederlande