Wärmeableitungsmodul, Wärmeableitungsvorrichtung Damit, Hf-Modul für Antenne, Antennenvorrichtung und Beleuchtungsvorrichtung

Details

Veröffentlichungs-Nr.

EP4773441

Anmeldetag

16. August 2024

Veröffentlichung

6. März 2025

Rechtsraum

EP

Abstract

The present invention relates to a heat dissipation module, a heat dissipation device including same, an antenna device, and a lighting device. The heat dissipation module comprises a heat conduction panel body having a refrigerant flow space that is a sealed space in which a refrigerant is accommodated and circulates between liquid and vapor phases while undergoing a phase change to transfer heat, wherein the refrigerant flow space comprises: a first section serving as an evaporation region that receives heat from a heat-generating element to be cooled; and a second section serving as a path through which a liquid refrigerant, condensed from a vapor phase of the refrigerant, flows to the first section by surface tension or gravity, and wherein the heat-generating element is coupled to an outer side of the heat conduction panel body corresponding to the first section by either a fitting method or a bonding method.

Anmelder

Firma

KMW Inc.

Land

🇰🇷 Südkorea