Kondensationsplattenanordnung und Wärmeableitungsvorrichtung damit

Details

Veröffentlichungs-Nr.

EP4773744

Anmeldetag

16. August 2024

Veröffentlichung

6. März 2025

Rechtsraum

EP

IPC

H05K7/20, F28D15/02

Abstract

The present invention relates to a condensing panel assembly and a heat dissipation device including same, and, particularly, comprises: an evaporation panel assembly which has a storage unit for storing a refrigerant capable of phase-changing according to temperature, and of which at least a part of the lower surface is in surface thermal contact with heating surfaces of heating elements; and a plurality of condensing panel assemblies which are coupled to the evaporation panel assembly so as to allow communication with the storage unit, and which emit heat transferred from the heating elements through heat exchange with the outside air (outdoor air), wherein each of the plurality of condensing panel assemblies include: a one-side heat conduction panel sheet-metal processed through press-molding as a metal panel member having at least a predetermined thermal conductivity; and an other-side heat conduction panel sheet-metal processed through press-molding as the same metal panel member as the one-side heat conduction panel, and thus the heat dissipation performance of the heat dissipation device is maximized.

Anmelder

Firma

KMW Inc.

Land

🇰🇷 Südkorea

Fachgebiete