Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements
Anmelder: SK hynix Inc. 🇰🇷
Details
- Veröffentlichungs-Nr.
- EP4773753
- Anmeldetag
- 22. Oktober 2025
- Veröffentlichung
- 8. Juli 2026
- Rechtsraum
- EP
Abstract
A semiconductor device includes a gate structure including a source select line, a drain select line, and word lines stacked between the source select line and the drain select line; a second channel layer penetrating through the source select line and including polysilicon; a third channel layer penetrating through the drain select line and including polysilicon; a first channel layer penetrating through the word lines, connected between the second channel layer and the third channel layer, and including molybdenum disulfide (MoS<sub>2</sub>); and an insulating core disposed inside the first channel layer.
Anmelder
- Firma
- SK hynix Inc.
- Land
- 🇰🇷 Südkorea
Südkoreanischer Halbleiterhersteller, der Speicherchips wie DRAM und NAND-Flash für Computer, Server und mobile Geräte produziert.
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