Quantenvorrichtung und Verfahren zur Herstellung einer Quantenvorrichtung

Details

Veröffentlichungs-Nr.

EP4773790

Anmeldetag

25. November 2025

Veröffentlichung

8. Juli 2026

Rechtsraum

EP

Abstract

A quantum device (100) includes a quantum chip (10) including a substrate (11) having a first surface (12) and a second surface (13), a quantum bit (15) provided on the first surface, and an electrode (18) electrically connected to the quantum bit and provided on the second surface, a mounting portion (30) having a mounting surface (32) on which a peripheral edge portion of the quantum chip is mounted, the mounting portion having a linear expansion coefficient different from that of the substrate, a conductor pin (40) having a tip end in contact with the electrode, and a holding portion (50) fixed to the mounting portion, the holding portion holding the conductor pin and having a linear expansion coefficient different from that of the substrate, wherein the electrode has a shape having a longitudinal direction in a direction radially extending from a center of the substrate in plan view, and the quantum chip is mounted on the mounting surface by inserting a protrusion (31) provided on one of the substrate and the mounting surface into a hole (19) provided on another of the substrate and the mounting surface, the hole having a longitudinal direction in a direction extending radially in plan view.

Anmelder

Firma

FUJITSU LIMITED

Land

🇯🇵 Japan