Geformte Vorrichtungsverpackungen mit Kapazitiven Strukturen
Anmelder: NXP USA, Inc. 🇺🇸
Details
- Veröffentlichungs-Nr.
- EP4773796
- Anmeldetag
- 13. November 2025
- Veröffentlichung
- 8. Juli 2026
- Rechtsraum
- EP
Abstract
One or more integrated capacitors can be formed within the molding material(s) of a molded electronic device package. An electronic device such as a semiconductor die is surrounded by a first volume of molding material and a first capacitor plate is formed on a top surface of the first volume of molding material above the electronic device. A second volume of molding material is formed above the first capacitor plate and a second capacitor plate is formed on a top surface of the second volume of molding material which separates the second capacitor plate from the first capacitor plate.
Anmelder
- Firma
- NXP USA, Inc.
- Land
- 🇺🇸 USA
US-amerikanische Gesellschaft des Halbleiterkonzerns NXP, die Chips und Halbleiterlösungen für Automobiltechnik, Kommunikation und Industrieelektronik entwickelt.
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