Hängende Chip-Zu-Chip-Verbindungsbrücke für Zwischengehäuse

Details

Veröffentlichungs-Nr.

EP4773797

Anmeldetag

25. November 2025

Veröffentlichung

8. Juli 2026

Rechtsraum

EP

Abstract

Bridge die interposer packages, and related apparatuses, systems, and techniques are discussed. An interposer package includes a bridge die having a routing structure to interconnect multiple integrated circuit (IC) dies of the package. Power is provided to the IC dies by a mesh power supply metallization and a mesh ground metallization that extend from outside a perimeter of the bridge die to within the perimeter and over the routing structure. The bridge die may be absent through silicon vias (TSVs) and may be hanging such that it is exposed at the bottom of the package.

Anmelder

Firma

INTEL Corporation

Land

🇺🇸 USA