Verbundformeinsatz zur Herstellung von Mikrostrukturierten Linsen

Details

Veröffentlichungs-Nr.

EP4775373

Anmeldetag

19. Juli 2021

Veröffentlichung

15. Juli 2026

Rechtsraum

EP

IPC

B29D11/00, B29C33/42B29C33/42

Abstract

A mold insert includes a base, a material of the base being a metal; a body disposed adjacent to the base along a first side of the body, a material of the body having a thermal conductivity between 0.05 and 5 W/m-K; and a working stamp disposed adjacent to the body along a second side of the body, the working stamp including a plurality of microstructures, wherein a thickness of the working stamp is 100 µm to 500 µm, and wherein the microstructures have a height or a depth, said height or depth being of 0.1 µm to 50 µm.

Anmelder

Firma

ESSILOR INTERNATIONAL

Land

🇫🇷 Frankreich

Fachgebiete