Selbstgeführte Diffusionsmodelle für Ungepaarte und Schwach Gepaarte Daten mit Anwendungen bei der Herstellung Integrierter Schaltungen

Details

Veröffentlichungs-Nr.

EP4776067

Anmeldetag

8. Januar 2025

Veröffentlichung

15. Juli 2026

Rechtsraum

EP

IPC

G03F7/00

Abstract

A computer-implemented method of processing first metrology data of a patterned portion of a substrate patterned using a wafer processing apparatus to generate predicted second metrology data of the, or another corresponding, patterned portion of the substrate, the first metrology data comprising metrology data from a first metrology domain which obtains metrology data using a first metrology process. The method comprises obtaining the first metrology data of the patterned portion of the substrate, and generating predicted second metrology data of the patterned portion of the substrate, or of the corresponding patterned portion of the substrate, based on the output of a first trained diffusion model conditioned on the first metrology data, the predicted second metrology data comprising predicted metrology data from a second metrology domain which obtains metrology data using a second metrology process.

Anmelder

Firma

ASML Netherlands B.V.

Land

🇳🇱 Niederlande

Fachgebiete