Halbleitergehäuse mit einem Draht- oder Bandgebundenen Kühlkörper
Anmelder: Infineon Technologies Austria AG 🇦🇹
Details
- Veröffentlichungs-Nr.
- EP4776332
- Anmeldetag
- 14. Januar 2025
- Veröffentlichung
- 15. Juli 2026
- Rechtsraum
- EP
Abstract
A semiconductor package includes a semiconductor chip having a first surface and a second surface opposite the first surface. The semiconductor chip is a lateral semiconductor device. A plurality of chip pads is arranged on the first surface of the semiconductor chip. The semiconductor chip is mounted on a carrier, wherein the semiconductor chip is bonded to the carrier with the first surface facing the carrier. A heatsink is disposed over the semiconductor chip. The heatsink is bonded to the semiconductor chip with the second surface of the semiconductor chip facing the heatsink. A conductor loop is bonded to the carrier, wherein a loop section of the conductor loop is connected to the heatsink. The conductor is a wire or a ribbon.
Anmelder
- Firma
- Infineon Technologies Austria AG
- Land
- 🇦🇹 Österreich
Österreichische Konzerngesellschaft des deutschen Halbleiterherstellers Infineon mit Sitz in Villach. Entwickelt und fertigt Halbleiterbauelemente für Automobil-, Energie- und Industrieanwendungen.
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