Halbleiteranordnung
Anmelder: SAMSUNG ELECTRONICS CO., LTD. 🇰🇷
Details
- Veröffentlichungs-Nr.
- EP4776787
- Anmeldetag
- 8. August 2025
- Veröffentlichung
- 15. Juli 2026
- Rechtsraum
- EP
Abstract
A semiconductor device includes a channel layer (132), a barrier layer (136) on the channel layer (132), a gate electrode layer (155) on the barrier layer (136) and extending in a first direction (D1) parallel to an upper surface of the barrier layer (136), a gate semiconductor layer (152) between the barrier layer (136) and the gate electrode layer (155), a source electrode (173) and a drain electrode (175) connected to the channel layer (132) and spaced apart from the gate electrode layer (155) in a second direction (D2) parallel to the upper surface of the barrier layer (136) and different from the first direction (D1), and a first barrier layer doping region (1361) within the barrier layer (136) and connected to the source electrode (173). In a cross-section in the second direction (D2) and in a third direction (D3) perpendicular to the upper surface of the barrier layer (136), an upper surface length of the gate electrode layer (155) is less than a lower surface length of the gate electrode layer (155).
Anmelder
- Firma
- SAMSUNG ELECTRONICS CO., LTD.
- Land
- 🇰🇷 Südkorea
Südkoreanischer Elektronikkonzern und Teil der Samsung-Gruppe. Entwickelt und produziert Halbleiter, Speicherchips, Displays, Smartphones, Unterhaltungselektronik sowie Haushaltsgeräte für den globalen Markt.
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