Anzeigechip und Anzeigevorrichtung und Herstellungsverfahren dafür

Details

Veröffentlichungs-Nr.

EP4776801

Anmeldetag

30. August 2024

Veröffentlichung

13. März 2025

Rechtsraum

EP

IPC

H10H20/858

Abstract

Provided are a display chip and a display apparatus and a preparation method therefor. The display chip comprises: an epitaxial layer, the epitaxial layer comprising a first semiconductor layer, a quantum well light-emitting layer, and a second semiconductor layer which are sequentially stacked and arranged; a first reflective layer, which is located on the side of the second semiconductor layer away from the first semiconductor layer; a first metal binding layer, which is located on the side of the first reflective layer away from an epitaxial structure; a heat dissipation layer, the heat dissipation layer comprising a first heat dissipation layer and/or a second heat dissipation layer. The first heat dissipation layer is located between the epitaxial structure and the first reflective layer, the second heat dissipation layer is located on the side of the first reflective layer away from the epitaxial structure, the second heat dissipation layer is provided with a first opening exposing the first reflective layer, and the first metal binding layer is arranged on the side of the second heat dissipation layer away from the first reflective layer and fills the first opening. The described structure may improve the heat dissipation performance of the display chip.

Anmelder

Firma

Beijing Zitiao Network Technology Co., Ltd.

Land

🇨🇳 China

Fachgebiete